Dr. Hsiao Chih-Pin, the president of the Chinese American Semiconductor Professional Association (CASPA), recently delivered a compelling keynote speech at the Global Semiconductor Forum, which drew industry leaders, experts, executives, and investors from around the world. Centered around the theme “Democratization of Artificial Intelligence,” the forum explored AI-driven technological innovations and their profound impact on the semiconductor supply chain. Attendees engaged in discussions about the opportunities and challenges faced by the semiconductor industry in the era of AI, while also contemplating the future trends in technological development.

As the core of a new technological revolution, AI is radically transforming multiple industries, particularly within the semiconductor sector, where its influence is especially significant. During the forum, Dan Armbrust, co-founder of Silicon Catalyst and a seasoned semiconductor investor, elaborated on how AI technology is driving continuous innovation and transformation in the semiconductor field.

Armbrust emphasized that the rapid advancements in AI are leading to an exponential increase in demand for semiconductors, particularly in areas such as deep learning, autonomous driving, and smart manufacturing. These applications require more efficient computing power and low-power chip designs. This urgent demand for high-performance chips is propelling the entire semiconductor industry toward more advanced technological levels, particularly in chip architecture, material innovation, and packaging processes, thereby stimulating substantial research investments.

He stated, “AI is not only having a transformative impact on applications but, as the technological backbone, the semiconductor industry stands at the forefront of historical change. The development of AI and machine learning is making the semiconductor sector more complex and critical than ever before. We are facing a new gold rush.”

The innovation in the industry has shifted from being driven by traditional Moore’s Law to being led by AI applications, a shift that will continue to deeply influence the direction of future technological advancements.

Since its inception in 1991, CASPA has aimed to connect semiconductor professionals globally, fostering collaboration and supporting industry innovation. During the forum, current president Hsiao Chih-Pin reflected on CASPA’s accomplishments over the past 30 years and underscored the importance of global cooperation in the semiconductor industry moving forward.

Hsiao remarked, “From the very beginning, CASPA has been dedicated to building bridges for global Chinese semiconductor professionals and facilitating technical exchange and collaboration. Today, the semiconductor industry is at an unprecedented turning point, especially with the rapid development of generative AI, making global collaboration in the semiconductor landscape particularly vital. We will continue to uphold this mission, connecting technological capabilities worldwide to collectively face the challenges and opportunities of the AI era.”

Participants also expressed concerns about the innovative bottlenecks facing the semiconductor industry. As Moore’s Law approaches its physical limits, traditional technologies are proving inadequate for sustaining future chip performance enhancements. Addressing challenges related to power density, heat dissipation, and energy efficiency has become a pressing technical issue for the semiconductor sector.

Armbrust warned, “In the next five to ten years, the industry must discover innovative solutions that break through existing physical limitations, potentially involving new materials and fundamental changes in chip architecture.”

The forum concluded with awards presented to devoted volunteers who have significantly contributed to CASPA over the years. Several volunteers reflected on their experiences with CASPA and shared their visions for further advancing the development of the semiconductor industry and tech community. CASPA has attracted many volunteers from around the globe, who not only contribute through event planning and technical support but also express a deep emotional connection to the CASPA community.